JPS5756527Y2 - - Google Patents

Info

Publication number
JPS5756527Y2
JPS5756527Y2 JP1977022962U JP2296277U JPS5756527Y2 JP S5756527 Y2 JPS5756527 Y2 JP S5756527Y2 JP 1977022962 U JP1977022962 U JP 1977022962U JP 2296277 U JP2296277 U JP 2296277U JP S5756527 Y2 JPS5756527 Y2 JP S5756527Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977022962U
Other languages
Japanese (ja)
Other versions
JPS53118464U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977022962U priority Critical patent/JPS5756527Y2/ja
Priority to DE2807601A priority patent/DE2807601A1/de
Priority to FR7805408A priority patent/FR2382100A1/fr
Publication of JPS53118464U publication Critical patent/JPS53118464U/ja
Priority to US06/105,964 priority patent/US4340901A/en
Application granted granted Critical
Publication of JPS5756527Y2 publication Critical patent/JPS5756527Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1977022962U 1977-02-25 1977-02-25 Expired JPS5756527Y2 (en])

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1977022962U JPS5756527Y2 (en]) 1977-02-25 1977-02-25
DE2807601A DE2807601A1 (de) 1977-02-25 1978-02-22 Loetverbindung zwischen einem elektrischen bauteil, insbesondere halbleiterelement, und einer zuleitung
FR7805408A FR2382100A1 (fr) 1977-02-25 1978-02-24 Structure de brasage d'un conducteur sur un dispositif semi-conducteur
US06/105,964 US4340901A (en) 1977-02-25 1979-12-21 Lead connecting structure for a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977022962U JPS5756527Y2 (en]) 1977-02-25 1977-02-25

Publications (2)

Publication Number Publication Date
JPS53118464U JPS53118464U (en]) 1978-09-20
JPS5756527Y2 true JPS5756527Y2 (en]) 1982-12-04

Family

ID=12097205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977022962U Expired JPS5756527Y2 (en]) 1977-02-25 1977-02-25

Country Status (4)

Country Link
US (1) US4340901A (en])
JP (1) JPS5756527Y2 (en])
DE (1) DE2807601A1 (en])
FR (1) FR2382100A1 (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698853A (en) * 1980-01-11 1981-08-08 Hitachi Ltd Structure of lead in semiconductor device
JPS60166150U (ja) * 1984-04-11 1985-11-05 日本碍子株式会社 集積回路装置用リ−ドフレ−ム
JP3117828B2 (ja) * 1992-12-28 2000-12-18 ローム株式会社 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
JP2005191147A (ja) * 2003-12-24 2005-07-14 Sanyo Electric Co Ltd 混成集積回路装置の製造方法
DE102010053760A1 (de) * 2010-12-02 2012-06-06 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor mit einem vorzugsweise mehrschichtigen Keramiksubstrat und Verfahren zu dessen Herstellung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT206006B (de) * 1957-07-23 1959-11-10 Telefunken Gmbh Zuleitung zu einer Legierungsstelle einer Kristallode des Legierungstyps
DE1439642A1 (de) * 1963-08-08 1969-01-23 Telefunken Patent Elektrisches Bauelement
US3277232A (en) * 1964-02-21 1966-10-04 Electra Mfg Company Lead construction for miniature electrical circuit elements
US3405382A (en) * 1965-09-13 1968-10-08 Beckman Instruments Inc Terminal and tap connections for resistance element
FR1524758A (fr) * 1966-06-01 1968-05-10 Rca Corp Dispositif semiconducteur et son procédé de fabrication
DE1966001C3 (de) * 1967-09-12 1974-06-06 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement. Ausscheidung aus: 1911915
DE1589543B2 (de) * 1967-09-12 1972-08-24 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement und verfahren zu seiner weichlotkontaktierung
US3681667A (en) * 1969-12-12 1972-08-01 Gen Electric Controlled rectifier and triac with laterally off-set gate and auxiliary segments for accelerated turn on
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
CH553480A (de) * 1972-10-31 1974-08-30 Siemens Ag Tyristor.
JPS5220230B2 (en]) * 1973-06-22 1977-06-02
US4141028A (en) * 1977-08-10 1979-02-20 Rca Corporation Contact clip
US4185317A (en) * 1977-12-22 1980-01-22 Union Carbide Corporation Anode and cathode lead wire assembly for solid electrolytic capacitors

Also Published As

Publication number Publication date
FR2382100A1 (fr) 1978-09-22
US4340901A (en) 1982-07-20
DE2807601A1 (de) 1978-08-31
FR2382100B1 (en]) 1984-01-13
JPS53118464U (en]) 1978-09-20

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